As long as TSMC keeps improving die size it will keep getting incremental improvements. These power/thermal improvements are not really that much up to nvidia.

As long as TSMC keeps improving die size it will keep getting incremental improvements. These power/thermal improvements are not really that much up to nvidia. The intel problem was that their foundries couldn't improve the die size while the other foundries kept improving theirs. But technically nvidia can switch foundry if another one proves better than TSMC even though that doesn't seem likely (at least without a major breakthrough not capitalized by ASML).