I feel like this tech would be better suited to flexible circuitry, because flexible can be continuous feed, and why try to limit or size your stamp to the surf

I feel like this tech would be better suited to flexible circuitry, because flexible can be continuous feed, and why try to limit or size your stamp to the surface area of a wafer when you could just size it to the width of a spool? Also flexible circuits tend to be at a much larger feature size and so it’s okay if they’re a couple generations behind, but this is still far ahead of printed circuitry.