According to this article the claimed thermal resistance is in the order of 0.4-0.2K cm2/W: http://news.softpedia.com/news/SONY-Demos-Best-Thermal-Pad-in-the-W

According to this article the claimed thermal resistance is in the order of 0.4-0.2K cm2/W: http://news.softpedia.com/news/SONY-Demos-Best-Thermal-Pad-in-the-World-281342.shtml http://news.softpedia.com/news/SONY-Demos-Best-Thermal-Pad-i... This is nothing new or earth-shattering as far as I am concerned. I've been using various thermal interface materials over the years for interfacing elements needing to be cooled to heat-sinks. These components range from MOSFETs to LEDs and FPGAs. You can easily achieve thermal resistance down to 0.11 K cm2/W with form-in-place sheets from companies such as Fujipoly: http://www.fujipoly.com/products/sarcon-thermal-management-components.html http://www.fujipoly.com/products/sarcon-thermal-management-c... In some cases the tradeoff is between high thermal conductivity and electrical conductivity. Where application requirements dictate that the thermal interface material (TIM) not conduct electricity (high-power LEDs typically have the thermal slug connected to the anode) you have to select TIMs that might not contain aluminum or other conductive compounds. In these cases you might take a thermal conductivity hit. That said, there are manufacturing techniques for such assembles that enable the use of electrically-conductive high-thermal-conductivity TIMs while greatly enhancing the thermal characteristics of the entire assembly. One that comes to mind is the use of aluminum-clad printed circuit boards as an intermediate step. EDIT: Used "thermal conductivity" when the numbers referred to "thermal resistance"