I get that for state of the art fabs. Those optimize for long runs on big wafers. My question though is can you find a solution at a different node which favors

I get that for state of the art fabs. Those optimize for long runs on big wafers. My question though is can you find a solution at a different node which favors cost/turnaround at the expense of not scaling? For example, could one make a 200nm node with conventional UV masks and a limit of say 10 layers? Non mask lithography options? Or as in the article 'sub' masks where you step a single die image across the wafer?