That's kind of what we're doing already, although the stacking is parallel, not perpendicular. A lot of the innovation is in how the dies are tied together, cf.

That's kind of what we're doing already, although the stacking is parallel, not perpendicular. A lot of the innovation is in how the dies are tied together, cf. https://www.anandtech.com/show/9520/toshiba-brings-throughsilicon-vias-to-nand-flash https://www.anandtech.com/show/9520/toshiba-brings-throughsi...