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Where’s the point where you figure out how to stack chiplets perpendicular to a backplane instead of doing lithography 300 times on the same chip?
by hinkley 2y ago
Where’s the point where you figure out how to stack chiplets perpendicular to a backplane instead of doing lithography 300 times on the same chip?
- duskwuff 2y agoThat's kind of what we're doing already, although the stacking is parallel, not perpendicular. A lot of the innovation is in how the dies are tied together, cf. https://www.anandtech.com/show/9520/toshiba-brings-throughsilicon-vias-to-nand-flash https://www.anandtech.com/show/9520/toshiba-brings-throughsi...
- creer 2y agoThis is an interesting testament to manufacturing reliability - that they can go to so many layers and still achieve good yield.
- mlyle 2y agoAs others here have pointed out -- you don't need to do lithography 300 times. The big breakthrough of 3D NAND is depositing alternating layers of films to build most of the layers. This is 3 stacks of >100 layers.