4 ms·
No, but any programming that would occur with identifiable information would occur after the wafer is cut and packaged. Generally this would be after delivery t
by j_walter 2y ago
No, but any programming that would occur with identifiable information would occur after the wafer is cut and packaged. Generally this would be after delivery to TSMC's customer.
- 0xTJ 2y agoThere isn't any indication here one way or the other, but some the unique IDs of some devices (Microchip unique MAC chips) are documented as being programmed as a wafer, before being diced (as justification for them not being in serial order on a reel, that they may be shuffled from wafer to packaging).