The thin nature of flex circuits have interesting implications for capacitance / parasitic inductance. I've been told that flex circuits are far easier to pass

The thin nature of flex circuits have interesting implications for capacitance / parasitic inductance. I've been told that flex circuits are far easier to pass EMC testing due to the physically closer ground/reference return path. Of course: with the caveat that solid planes of copper are not flexible and will crack. So ground-grid are the best you can do. But physically closer / physically thinner circuits have niche advantages. ------- But I'm talking about traditional silicon dies on a flexpcb. This article is about printing some kind of flexible chip to begin with. It's cool and relatively new, but silicon + flexpcb will be the main technique for e-textiles (and other flex applications) for the near future. Still, one more tool in the toolbox for electrical engineers. Niche as it is, it's still a tool with likely some good application somewhere.