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by VWWHFSfQ 2y ago
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- btbuilder 2y agoAssembly of the phone or device using the processor.
- VWWHFSfQ 2y agowe're talking about the chip itself. Not the phone
- branko_d 2y agoThe dies themselves are "assembled" - cut from the wafer, bonded to the wires (or solder bumps) that carry signals to the rest of the system, and packaged for physical protection and thermal management. In recent times, multi-chiplet architecture has added its own layer of complexity to that process. See also: OSAT.
- chipdude1973 2y agoTwo points to counter the snark: 1. The output of a "chip manufacturing" process is a wafer. There is absolutely further assembly (bonding, packaging) done on this output. 2. The chips themselves are not for the end user's consumption. They are assembled into a product, a "consumer electronic".
- dang 2y agoPlease follow the site guidelines when commenting here: https://news.ycombinator.com/newsguidelines.html https://news.ycombinator.com/newsguidelines.html. We've had to ask you this before (https://news.ycombinator.com/item?id=35998957 https://news.ycombinator.com/item?id=35998957), so if you wouldn't mind reviewing https://news.ycombinator.com/newsguidelines.html https://news.ycombinator.com/newsguidelines.html and taking the intended spirit of the site more to heart, we'd be grateful.