4 ms·
How did they remove "the package" for this one? The usual sodium hydroxide or?
by metadat 2y ago
How did they remove "the package" for this one? The usual sodium hydroxide or?
- gradschoolfail 2y agoMy guess its laser and/or micromachining
- revax 2y agoUsually you use fuming nitric acid with or without sulfuric acid depending if you have copper bondings. https://www.semitracks.com/reference-material/failure-and-yield-analysis/failure-analysis-package-level/delid-and-decap.php https://www.semitracks.com/reference-material/failure-and-yi...
- axoltl 2y agoIn my experience just hot sulfuric acid works fairly well if you're looking to just get the die out. Just don't leave it too long or you won't have any bond pads left...