The graphic from the OIST in the link makes reference to both the reduced power needed and reduced capital costs, less mirrors & cheaper EUV light source. Also,

The graphic from the OIST in the link makes reference to both the reduced power needed and reduced capital costs, less mirrors & cheaper EUV light source. Also, less power -> less heat -> less cooling. I scoured for some other info as well: A single chip would go through a photo-lithography tool about 80 times. A photo-lithography tool can work on approx. 125 wafers per hour (5 FOUPS). A wafer contains ~230 chips. Current EUV light source requires a 20kw carbon laser. https://www.youtube.com/watch?v=dX9CGRZwD-w https://www.youtube.com/watch?v=dX9CGRZwD-w https://www.youtube.com/watch?v=5Ge2RcvDlgw https://www.youtube.com/watch?v=5Ge2RcvDlgw