Which part of the org is affected? I'm hearing it's mostly staff working on Packaging, Si Photonics, Glass Packaging, and Heterogeneous 3D in order to refocus

Which part of the org is affected? I'm hearing it's mostly staff working on Packaging, Si Photonics, Glass Packaging, and Heterogeneous 3D in order to refocus their Logic scaling to HighNA EUV. So mostly outsourcing the low margins and commodified OSAT and Packaging portions.