I've seen multiple rumor-style explanations to this issue, including: - it may have to do with oxidation of metallic copper deposited inside through-sillicon

I've seen multiple rumor-style explanations to this issue, including: - it may have to do with oxidation of metallic copper deposited inside through-sillicon via(TSV) - it may have to do with improper connection between die and substrate(that hard green plate) causing higher resistance and temperature somewhere, which is by the way the true limiting factor for socket Tjmax - it could have to do with VCORE values used to meet the performance target being too high for the on-die ring bus logic including L1 - it is possibly related to big-little heterogeneous configuration and how voltages for big-core and little-core/uncore/IO are generated - I've heard they had an HVAC outage in one of US fabs and it ruined some dies - Yeah they just flew too close to the Sun, frankly - ... I have absolutely no skin in this game, and my question is: are there any more plausible technobabbly stories around? It all sounds intriguing to me. Some of it could be correct or relevant.