4 ms·

There are no sticks in my laptop. I was taking about soldered RAM as is he norm on recent high speed LPDDR5X laptops.

Joel_Mckay 2y ago
Please pull the chip maker/model off your rig: sudo apt-get install cpu-x sudo cpu-x We may still be able to use this information to compare with other users glitches to see if there is some underlying similarity. Unfortunately, if it is a thermal stress/warping on the PCB cracking open RAM BGA balls on chips or shifting traces... One won't really be able to completely identify the intermittent issue. We were actually looking at buying a similar economy model earlier this year (ended up with a few classic Lenovo models instead)... so please be verbose with the make/model to help future searchers =3
- Rinzler89 2y ago
  Can't be thermal, I checked.
  - Joel_Mckay 2y ago
    X-ray vision like Superman I gather... nice... ;) Please dump the problematic cpu/ram chip model numbers to help other users. These chip manufacturer numbers is not really personally identifiable information, as they are shared between hundreds of thousands of products. The classic cpu-z for Windows users is here if you don't run *nix: https://www.cpuid.com/softwares/cpu-z.html https://www.cpuid.com/softwares/cpu-z.html Best regards, =3
    - Rinzler89 2y ago
      >X-ray vision like Superman I gather... nice... ;) That snarkyness is uncalled for. I repasted the laptop, ran benchmarks and checked the temperature sensors plus used my FLIR. It's no thermal issues. It's just AMD iGPU driver buggyness. Processors Information ------------------------------------------------------------------------- Socket 1 ID = 0 Number of cores 8 (max 8) Number of threads 16 (max 16) Secondary bus # 0 Number of CCDs 1 Manufacturer AuthenticAMD Name AMD Ryzen 7 7840HS Codename Phoenix Specification AMD Ryzen 7 7840HS with Radeon 780M Graphics Package Socket FP7 CPUID F.4.1 Extended CPUID 19.74 Core Stepping PHX-A1 Technology 4 nm TDP Limit 54.0 Watts Tjmax 90.0 °C Core Speed 2761.5 MHz Multiplier x Bus Speed 27.71 x 99.6 MHz Base frequency (cores) 99.6 MHz Base frequency (mem.) 99.6 MHz Instructions sets MMX (+), SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A, x86-64, AES, AVX, AVX2, AVX512 (DQ, BW, VL, CD, IFMA, VBMI, VBMI2, VNNI, BITALG, VPOPCNTDQ, BF16), FMA3, SHA Microcode Revision 0xA704104 L1 Data cache 8 x 32 KB (8-way, 64-byte line) L1 Instruction cache 8 x 32 KB (8-way, 64-byte line) L2 cache 8 x 1024 KB (8-way, 64-byte line) L3 cache 16 MB (16-way, 64-byte line) Preferred cores 2 (#1, #3) Max CPUID level 0000000Dh Max CPUID ext. level 80000026h FID/VID Control yes # of P-States 3 P-State FID 0x898 - VID 0xBF (38.00x - 1.194 V) P-State FID 0x858 - VID 0xAB (22.00x - 1.069 V) P-State FID 0xA50 - VID 0x97 (16.00x - 0.944 V) PStateReg 0x80000000-0x49AFC898 PStateReg 0x80000000-0x45AAC858 PStateReg 0x80000000-0x4425CA50 PStateReg 0x00000000-0x00000000 PStateReg 0x00000000-0x00000000 PStateReg 0x00000000-0x00000000 PStateReg 0x00000000-0x00000000 PStateReg 0x00000000-0x00000000 Package Type 0x4 Model 00 String 1 0x0 String 2 0x0 Page 0x0 Power Unit 0.0 SMU Version 76.73.00 TDP/TJMAX 0x36005A TCTL Offset 0x0 PMTV 004C0008 Package Power Tracking (PPT) 54.0 W (current) Package Power Limit #1 (long) 35.0 W Package Power Limit #2 (short) 25.0 W DMI Physical Memory Array location Motherboard usage System Memory correction None max capacity 64 GB max# of devices 4 DMI Memory Device designation DIMM 0 format Row of chips type LPDDR5 total width 32 bits data width 32 bits size 8 GB speed 6400 MHz manufacturer Micron Technology part number MT62F2G32D4DS-026 WT serial number 00000000 voltage 0.500000 manufacturer id 0x2C80 product id 0x0 Display adapter 0 (primary) ID 0x2180003 Name AMD RadeonT 780M Board Manufacturer Lenovo Codename Phoenix Cores 768 ROP Units 16 Technology 4 nm Memory size 1024 MB Current Link Width x16 Current Link Speed 16.0 GT/s PCI device bus 99 (0x63), device 0 (0x0), function 0 (0x0) Vendor ID 0x1002 (0x17AA) Model ID 0x15BF (0x3819) Revision ID 0xC7 Root device bus 0 (0x0), device 8 (0x8), function 1 (0x1) Performance Level Current Core clock 800.0 MHz Shader clock 400.0 MHz Memory clock 800.0 MHz Driver version 32.0.11021.1011 WDDM Model 3.1
      - Joel_Mckay 2y ago
        People use special x-ray machines to inspect the BGA solder bonds to the PCB underneath chips. These chips may also be additionally glued down to the PCB on higher end equipment (impossible to visually inspect.) Note BGA chips were never initially intended to be larger than 20mm wide, and can still put enormous shear forces on the contact bonds as the solder solidifies post re-flow (and the bimetallic cantilever PCBs form start to pop-back.) A certain percentage of products will thus fail when they warm up as the PCB will locally heat/warp the area again, and foobar a few random connections in the process. A low-heat paint-stripper heat-blower might be able to replicate the crash to eliminate this theory, and you might be able to RMA the board/chips if you are still under warrantee. Could indeed also just be software as some suspect, but that is a lot harder to find in kernel drivers. It is hard to read peoples emotions online, but do assume if someone is reaching out to help they probably think you are worth respecting too. Thanks for posting data other users may find useful, and have a wonderful day. =3
        Rinzler89 2y ago
        No, it's not a solder/BGA issue because RAM/CPU/GPU stress benchmarks would cause some instabilities but that's never the case. The instability only manifests when running video decode tasks(watching youtube) in the browser and browsing websites in paralel, meaning it's 99% sure a iGPU driver issue.
        Joel_Mckay 2y ago
        Have you tried h264ify and blocked 60fps video? Might be interesting if the bug is codec dependent, as YT can stress some browsers configs (software codecs etc.) Does it do this with the windows 11 driver set as well? =)

Please pull the chip maker/model off your rig: sudo apt-get install cpu-x sudo cpu-x We may still be able to use this information to compare with other users glitches to see if there is some underlying similarity. Unfortunately, if it is a thermal stress/warping on the PCB cracking open RAM BGA balls on chips or shifting traces... One won't really be able to completely identify the intermittent issue. We were actually looking at buying a similar economy model earlier this year (ended up with a few classic Lenovo models instead)... so please be verbose with the make/model to help future searchers =3

Rinzler89 2y ago
Can't be thermal, I checked.
- Joel_Mckay 2y ago
  X-ray vision like Superman I gather... nice... ;) Please dump the problematic cpu/ram chip model numbers to help other users. These chip manufacturer numbers is not really personally identifiable information, as they are shared between hundreds of thousands of products. The classic cpu-z for Windows users is here if you don't run *nix: https://www.cpuid.com/softwares/cpu-z.html https://www.cpuid.com/softwares/cpu-z.html Best regards, =3
  - Rinzler89 2y ago
    >X-ray vision like Superman I gather... nice... ;) That snarkyness is uncalled for. I repasted the laptop, ran benchmarks and checked the temperature sensors plus used my FLIR. It's no thermal issues. It's just AMD iGPU driver buggyness. Processors Information ------------------------------------------------------------------------- Socket 1 ID = 0 Number of cores 8 (max 8) Number of threads 16 (max 16) Secondary bus # 0 Number of CCDs 1 Manufacturer AuthenticAMD Name AMD Ryzen 7 7840HS Codename Phoenix Specification AMD Ryzen 7 7840HS with Radeon 780M Graphics Package Socket FP7 CPUID F.4.1 Extended CPUID 19.74 Core Stepping PHX-A1 Technology 4 nm TDP Limit 54.0 Watts Tjmax 90.0 °C Core Speed 2761.5 MHz Multiplier x Bus Speed 27.71 x 99.6 MHz Base frequency (cores) 99.6 MHz Base frequency (mem.) 99.6 MHz Instructions sets MMX (+), SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A, x86-64, AES, AVX, AVX2, AVX512 (DQ, BW, VL, CD, IFMA, VBMI, VBMI2, VNNI, BITALG, VPOPCNTDQ, BF16), FMA3, SHA Microcode Revision 0xA704104 L1 Data cache 8 x 32 KB (8-way, 64-byte line) L1 Instruction cache 8 x 32 KB (8-way, 64-byte line) L2 cache 8 x 1024 KB (8-way, 64-byte line) L3 cache 16 MB (16-way, 64-byte line) Preferred cores 2 (#1, #3) Max CPUID level 0000000Dh Max CPUID ext. level 80000026h FID/VID Control yes # of P-States 3 P-State FID 0x898 - VID 0xBF (38.00x - 1.194 V) P-State FID 0x858 - VID 0xAB (22.00x - 1.069 V) P-State FID 0xA50 - VID 0x97 (16.00x - 0.944 V) PStateReg 0x80000000-0x49AFC898 PStateReg 0x80000000-0x45AAC858 PStateReg 0x80000000-0x4425CA50 PStateReg 0x00000000-0x00000000 PStateReg 0x00000000-0x00000000 PStateReg 0x00000000-0x00000000 PStateReg 0x00000000-0x00000000 PStateReg 0x00000000-0x00000000 Package Type 0x4 Model 00 String 1 0x0 String 2 0x0 Page 0x0 Power Unit 0.0 SMU Version 76.73.00 TDP/TJMAX 0x36005A TCTL Offset 0x0 PMTV 004C0008 Package Power Tracking (PPT) 54.0 W (current) Package Power Limit #1 (long) 35.0 W Package Power Limit #2 (short) 25.0 W DMI Physical Memory Array location Motherboard usage System Memory correction None max capacity 64 GB max# of devices 4 DMI Memory Device designation DIMM 0 format Row of chips type LPDDR5 total width 32 bits data width 32 bits size 8 GB speed 6400 MHz manufacturer Micron Technology part number MT62F2G32D4DS-026 WT serial number 00000000 voltage 0.500000 manufacturer id 0x2C80 product id 0x0 Display adapter 0 (primary) ID 0x2180003 Name AMD RadeonT 780M Board Manufacturer Lenovo Codename Phoenix Cores 768 ROP Units 16 Technology 4 nm Memory size 1024 MB Current Link Width x16 Current Link Speed 16.0 GT/s PCI device bus 99 (0x63), device 0 (0x0), function 0 (0x0) Vendor ID 0x1002 (0x17AA) Model ID 0x15BF (0x3819) Revision ID 0xC7 Root device bus 0 (0x0), device 8 (0x8), function 1 (0x1) Performance Level Current Core clock 800.0 MHz Shader clock 400.0 MHz Memory clock 800.0 MHz Driver version 32.0.11021.1011 WDDM Model 3.1
    - Joel_Mckay 2y ago
      People use special x-ray machines to inspect the BGA solder bonds to the PCB underneath chips. These chips may also be additionally glued down to the PCB on higher end equipment (impossible to visually inspect.) Note BGA chips were never initially intended to be larger than 20mm wide, and can still put enormous shear forces on the contact bonds as the solder solidifies post re-flow (and the bimetallic cantilever PCBs form start to pop-back.) A certain percentage of products will thus fail when they warm up as the PCB will locally heat/warp the area again, and foobar a few random connections in the process. A low-heat paint-stripper heat-blower might be able to replicate the crash to eliminate this theory, and you might be able to RMA the board/chips if you are still under warrantee. Could indeed also just be software as some suspect, but that is a lot harder to find in kernel drivers. It is hard to read peoples emotions online, but do assume if someone is reaching out to help they probably think you are worth respecting too. Thanks for posting data other users may find useful, and have a wonderful day. =3
      - Rinzler89 2y ago
        No, it's not a solder/BGA issue because RAM/CPU/GPU stress benchmarks would cause some instabilities but that's never the case. The instability only manifests when running video decode tasks(watching youtube) in the browser and browsing websites in paralel, meaning it's 99% sure a iGPU driver issue.
        Joel_Mckay 2y ago
        Have you tried h264ify and blocked 60fps video? Might be interesting if the bug is codec dependent, as YT can stress some browsers configs (software codecs etc.) Does it do this with the windows 11 driver set as well? =)