They cut the wafer apart with a diamond blade, 20 µm thick. Laser cutters can make thinner cuts, but they cost more. Die pick-and-place machines can manipulate

They cut the wafer apart with a diamond blade, 20 µm thick. Laser cutters can make thinner cuts, but they cost more. Die pick-and-place machines can manipulate even smaller dies at high speed: https://www.syagrussystems.com/dts-2-die-sorter https://www.syagrussystems.com/dts-2-die-sorter