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The chip seems like it's almost too small? I don't even know how they would cut up the wafer and how they would pick each die and mount it in the paper card.
by rwmj 2y ago
The chip seems like it's almost too small? I don't even know how they would cut up the wafer and how they would pick each die and mount it in the paper card.
- kens 2y agoThey cut the wafer apart with a diamond blade, 20 µm thick. Laser cutters can make thinner cuts, but they cost more. Die pick-and-place machines can manipulate even smaller dies at high speed: https://www.syagrussystems.com/dts-2-die-sorter https://www.syagrussystems.com/dts-2-die-sorter