3 ms·
It's not a BGA, it's a QFN with a ground pad.
by eulgro 2y ago
It's not a BGA, it's a QFN with a ground pad.
- Havoc 2y agoI see. What does that change in terms of process needed?
- a1o 2y agoBGA you need hot air and reflow but a QFN I think you can just position and solder by the side with a simple solder iron with a knife like tip.
- 15155 2y agoBGAs generally call for more complicated reflow profiles (including vapor phase reflow for very large BGAs - think 40mm+ FPGAs) and require X-ray inspection (if doing inspection at all.) BGA balls can have under-body solder voids, etc. BGA devices also generally specify a specific solder to use (leaded or lead-free won't be interchangeable.) Generally, all single-row package pin layouts are easier than double-row (BGA, WLCSP, 2-row QFN) to reflow.