To solve the heat issue let's limit ourselves to 2.5D chips, since the bottom layer barely heats. Die size:350mm2,millions of connections per mm2, meaning 350

To solve the heat issue let's limit ourselves to 2.5D chips, since the bottom layer barely heats. Die size:350mm2,millions of connections per mm2, meaning 350 million connections @1ghz - 350,000 tbit/sec of memory bandwidth. The realistic number Will probably be much lower, but still, even 2.5D could solve the memory wall.