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Decapsulating the CH32V203 Reveals a Separate Flash Die
- RetroTechie 2y agoInteresting! This could be read as: [Packaging separate dies, each made on distinct process] is cheaper than [use 1 process that is sub-optimal for big part(s) of the chip]. Or: advanced IC packaging is cheaper than advanced semiconductor manufacturing. Still surprising this works for a <$1 chip. But makes sense considering what a new semiconductor fab costs nowadays.