a “white hat” way to read this is that Apple has committed to two silicon integration steps: (i) integration of multi die on a silicon substrate and (ii) integr

a “white hat” way to read this is that Apple has committed to two silicon integration steps: (i) integration of multi die on a silicon substrate and (ii) integration of RAM and CPU on a single chip. these steps are each (say) an order over magnitude access speed improvement, so making the step sooner with less RAM means faster systems at lower cost. it also makes for a perverse incentive where a quicker step to integrated silicon makes the entry level systems faster than the power systems for many typical workloads.