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Shrinking things on silicon wafers.. The article explains that it has potential for welding and other commercial applications but it's not quite there yet. It
by hn72774 3y ago
Shrinking things on silicon wafers..
The article explains that it has potential for welding and other commercial applications but it's not quite there yet. It did cut through 100um steel. It's a good read.
- CyberDildonics 3y agoWhat does that have to do with "shrinking thing on silicon wafers" ? This isn't really even new technology. Welding and cutting lasers have been around for a while. Do you think that cutting steel and making CPUs is the same process or that making smaller transistors just needs more power in the laser?
- hn72774 3y agoNo
- hn72774 3y agoTl;dr from the article is that a chip or array of chips can soon replace a refrigerator-sized CO2 laser. They went from 1W to 50W in about 10 years, and have a path to kW scale which could replace those large industrial CO2 lasers with something much much smaller. Some googling confirmed that Moore wrote about component density, not specifically transistors. That confirms my hunch. An increasingly higher output laser on silicon fits the same pattern of exponential growth. Hope that helps you understand where I was coming from. As a layperson it seems like exciting science with lots of commercial and scientific applications (that are also described in the article). > Gordon Moore’s famous article is published in Electronics magazine. In the article, Moore predicts an annual doubling of component density on an integrated circuit at minimum manufacturing costs. Moore later identified “a component” as “transistor, resistor, diode or capacitor.” https://spectrum.ieee.org/moores-law-milestones https://spectrum.ieee.org/moores-law-milestones