4 ms·
I had no idea that regular black plastic IC packages were transparent enough in infrared to be able to image the underlying silicon. Is this by design? I wonde
by crispyambulance 3y ago
I had no idea that regular black plastic IC packages were transparent enough in infrared to be able to image the underlying silicon.
Is this by design? I wonder if this transparency causes problems with photo-sensitivity in some circuits.
- bunnie 3y agoThe technique only works on CSP and flip-chip packaged devices. These are chips that are basically bare silicon die that are bonded onto PCBs or substrates. This package type is fairly popular in mobile phones and many types of CPUs. The technique does not see through regular black plastic IC packages.
- eternauta3k 3y agohttps://forums.raspberrypi.com/viewtopic.php?f=28&t=99042 https://forums.raspberrypi.com/viewtopic.php?f=28&t=99042