3 ms·
We are about to witness ( although this has somewhat already happening ) where GPU or CPU are no longer measured by a single die but by package of multiple chip
by ksec 3y ago
We are about to witness ( although this has somewhat already happening ) where GPU or CPU are no longer measured by a single die but by package of multiple chiplets. You could have 4 x 250B transistor GPU Die packed together and the GPU will be 1 trillion transistor. And can continue to "claim" Moore's law is not broken.
- gvkhna 3y agoThe chiplet design is another innovation like FinFET and even EUV that is allowing for more transistors closer together. The interconnect for instance on the blackwell means no timing issues. The transistor size is already closing in on 1nm, there will be innovation there eventually, but any step can be a stepping stone. I don’t see the issue here.
- Kirby64 3y agoTransistors are nowhere close to 1nm right now. Current 3nm stuff is something like 20-40nm wide depending on how you measure it.
- nebula8804 3y agoYou are talking for Servers right? Else how do you plan to cool such a beast?
- coffeebeqn 3y agoWon’t it have large surface area too?
- The_Colonel 3y agoChiplets will be underclocked to run close to their most efficient power / performance frequency.
- guidedlight 3y agoExactly, this is what Apple are doing with their “Ultra” architecture. It really is the way forward.