4 ms·
Hahha, forcing a point yes, but also just being a little thick and not 'getting' the foam-pad method. THANK YOU. In real life, doing many through-hole componen
by AnthonBerg 14y ago
Hahha, forcing a point yes, but also just being a little thick and not 'getting' the foam-pad method. THANK YOU.
In real life, doing many through-hole components at once, I have tack soldered them top-side - when possible, e.g. resistors, not possible for radial caps.
- DanBC 14y agoIn production environments you buy special frames for that method. You can also get "cropping plates" and "cropping machines". A cropping plate is a sheet of steel with holes drilled for all through-hole component leads. You place a few PCBs on it, then stuff all components. You then place the plate on the cropping machine, which has "drop down pins" to hold the components in place and sliding blades under the plate which scrape / cut the leads off. You then take the PCBs off the plate and put them through a wave solder machine. One potential problem with tacking topside (and this is more theoretical than real) - sometimes the through hole plating is cracked. On a multilayer PCB this may mean that you don't have proper connection between all layers. If you only solder from the bottom of the board you can see if the solder has correctly flowed. Some high-spec jobs will forbid soldering on the topside. (Aerospace, etc.)