So, laptop motherboards are say 2mm thick, with components about 2mm on either side, all except 'tall' components like power electronics and things with heatsin

So, laptop motherboards are say 2mm thick, with components about 2mm on either side, all except 'tall' components like power electronics and things with heatsinks. Ram chips (~2mm thick) are soldered onto a board 2 mm thick, which uses 1mm spring contacts onto the motherboard. Total height: 5mm above the motherboard. So this CAMM system doesn't seem to actually solve the height or board area problem that was causing manufacturers to solder RAM directly.