What confuses me is that there seems to be a bathtub curve on the fab market. We've got the race to 7-5-3-2nm for high-end parts, and then a couple generations

What confuses me is that there seems to be a bathtub curve on the fab market. We've got the race to 7-5-3-2nm for high-end parts, and then a couple generations back on support chips and lower-performance cheap parts. Then you've got the dead zone. Is there a meaningful active use case for 1-micron processes anymore? But then you get to perennial embedded-market stuff (Z80, 65C02, 80186) originally built on 40-year-old processes. And going even further, you have stuff that's a handful of transistors on a die that was probably drawn with markers for the original lithography; I'm not sure we'd even use numbers to describe that process. How does that stuff get made anymore? It can't all be draining down old stock. I can't imagine it's cost effective to use modern-fab capacity to manufacture Z80s, 555s, or 74LS04s at their original die sizes. And if you shrunk them to put a million on a wafer, even assuming that's feasible, you'd change their performance characteristics in ways that might break long-established specs and contracts.