The packaging tech actually has to be less advanced to be economical. "That was the first generation. Xilinx worked with TSMC on CoWoS. Their codename was CoWo

The packaging tech actually has to be less advanced to be economical. "That was the first generation. Xilinx worked with TSMC on CoWoS. Their codename was CoWoS. It’s a funny name for TSMC’s silicon interposer. That was a first-generation advanced package technology... I talked to one of their VP. I talked to them many, many times, until one time, I had dinner with [a Qualcomm] VP, and he just very casually told me, he said, you know, “If you want to sell that to me, I would only pay one cent per millimeter square.” One cent per millimeter square. He said, “That’s the only cost I will pay for it.” I said, “How come you didn't tell me earlier?” He said, “You should know that. Why I should tell you? You should know that.” ...Our second generation called InFO meet that criteria and it was sell like a hotcake. So that one word saved my life and the InFO was why Apple was hooked by TSMC." https://www.computerhistory.org/collections/catalog/102792671 https://www.computerhistory.org/collections/catalog/10279267...