This is something that is in my area of expertise, and your suspicions are correct. Solder can "bubble" but this is a line process issue that is easily picked

This is something that is in my area of expertise, and your suspicions are correct. Solder can "bubble" but this is a line process issue that is easily picked up even in old AOI systems (automatic optical inspections) from 10-15 years ago. To be frank, this article to me, reads like piece put together by somebody who has no idea what they're on about to generate publicity for their company. Nothing to see here.