3 ms·
Stupid question: is “bump” the actual name for the bumps you talk about or is there some tricked out fancy name for them? (Curiosity only.)
by dmvdoug 3y ago
Stupid question: is “bump” the actual name for the bumps you talk about or is there some tricked out fancy name for them? (Curiosity only.)
- lizknope 3y agoYes, "bump" is the actual technical name. You can click on the wikipedia link I posted to flip chip. You can see a diagram here of the layer stack up. You can see that the solder bump on the top that connects to the outside world is huge compared to the internal metal layers. https://en.wikipedia.org/wiki/Back_end_of_line https://en.wikipedia.org/wiki/Back_end_of_line A standard cell in 5nm is around 200nm in height. The width can vary but this way all the cells go together like Lego bricks. Each metal layer going up from Metal1 to the top gets wider and thicker. By the time you get up to Metal18 or so it is probably 20 times wider and thicker than M1. This is useful because those upper layer metals distribute the power and ground and a chip wide clocks. The large top layer metal is also required for the huge bumps above that connect to the outside world. I think the current minimum bump pitch is around 130 microns. You can see these with your eye and don't need a microscope. Do the math on a chip that is 25mm by 25mm and a pitch of 130 microns and you can determine how many bumps you could fit on the chip.