> To be precise RAM is soldered on top of SoC in a PoP package. No, it’s not. A stacked PoP (not “PoP package,” that’s redundant) is used for recent A-series m

> To be precise RAM is soldered on top of SoC in a PoP package. No, it’s not. A stacked PoP (not “PoP package,” that’s redundant) is used for recent A-series mobile CPUs, but on M1/M2/M3 the memory is soldered on a PCB directly adjacent to the CPU. This allows for better heat dissipation and therefore higher clock speeds and memory bandwidth.