> but apple’s literal stacking of the LPDDR on the actual die doesn’t? There's pictures of Apple's silicon all over the Internet, didn't think to bother even l

> but apple’s literal stacking of the LPDDR on the actual die doesn’t? There's pictures of Apple's silicon all over the Internet, didn't think to bother even looking at one? https://cdn.mos.cms.futurecdn.net/EWuFBHNeGSfhjJfoWFxL7D-1024-80.jpg.webp https://cdn.mos.cms.futurecdn.net/EWuFBHNeGSfhjJfoWFxL7D-102... It's very obviously not on die. On package maybe, but definitely not on-die. Since you're talking about die stacking i assume you're now talking about their "low end" phone parts. That's a quite different technology from V-cache, foveros, or even Apple's "UltraFusion." It's also not at all a unique technology to Apple, it's very common in the phone SoC space where power consumption is so limited that the thermal issues are mostly negated.