3 ms·
The 3D Foveros packaging technology is critical as it allows some path lengths to be much shorter than if you had to traverse that same path but only in the hor
by bwhitty 3y ago
The 3D Foveros packaging technology is critical as it allows some path lengths to be much shorter than if you had to traverse that same path but only in the horizontal 2D plane.
Very excited to see how this plays out in practice.
- brucethemoose2 3y agoI thought Meteor Lake was tiled and 2D? Intel has EMIB and such for very good bridges, but they are still bridges. If it is 3D stacked with TSVs, thats a whole other can of worms. AMD's X3D on Ryzen 7000 creates heat/clockspeed issues, and they reportedly canceled a 3D variant of the 7900 GPUs due to similar issues.