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AFAIK this will be the first chip where multiple processes are combined into one die, at least for consumer devices. AMD's chiplets use separate dies from multi

AFAIK this will be the first chip where multiple processes are combined into one die, at least for consumer devices. AMD's chiplets use separate dies from multiple node processes all on one substrate so maybe they don't want to confuse it with that.

monocasa 3y ago
It isn't on one die; Meteor lake is 4 dies on a substrate. It's probably a lawyer thing like uncertainty over who owns the noun 'chiplet'.
- Covzire 3y ago
  The interconnect between dies doesn't rely on the substrate though right?
  - wmf 3y ago
    The interposer is the only way the dies can communicate.