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There's the intermediate step to 3D - 2.5D. it's when you lay all you dies side by side, on another chip, instead of a pcb. It makes relatively easy to manage
by ippisl 15y ago
There's the intermediate step to 3D - 2.5D. it's when you lay all you dies side by side, on another chip, instead of a pcb. It makes relatively easy to manage heat and you can get much more bandwidth at much lower power(much shorter wire distances). And it's already in use for high end fpga's.
- marshray 15y agoYou mean the multi-chip module (MCM) ? https://en.wikipedia.org/wiki/Multi-Chip_Module https://en.wikipedia.org/wiki/Multi-Chip_Module Those have been around forever. Or something different?
- jacquesm 15y agoHe's talking about this: http://www.eetimes.com/electronics-blogs/other/4210170/Xilinx-multi-FPGA-provides-mega-boost-re-capacity--performance--and-power-efficiency- http://www.eetimes.com/electronics-blogs/other/4210170/Xilin...
- marshray 15y agoCool! Thanks. I wonder if the price will ever come down to the point where it's used in consumer devices.