3 ms·
As IO drivers on the die get faster with more modern processes, this necessitates packages with less destructive parasitics. Your typical FPGA is about 40% powe
by mips_r4300i 3y ago
As IO drivers on the die get faster with more modern processes, this necessitates packages with less destructive parasitics. Your typical FPGA is about 40% power and ground pins. The fabric is sensitive to all the nasty stuff like ground bounce that is only made worse in through hole packages (not to mention, almost nobody would buy such a package).
Level translators are also all SMD.
There is really nothing to be afraid of with soldering SMD and once you spend an hour or two you will never bother with through hole stuff again.
- sponaugle 3y agoIndeed it is doable, and I do SMD work all the time both by hand and with my reflow oven. I have done some BGAs with some success ( and some spectacular failures ). The reason for the interest in through-hole building is for use in 'build-it-yourself' projects for other vintage enthusiasts who don't have SMD skills. I however should have been a bit more clear that I was referring not to an FPGA itself that is through-hole, but a PCB adapter to use a BGA FPGA in a through-hole application with high pin count. That distinction was not clear in my original comment.