4 ms·
These would be 3DS-RDIMMs: The DRAM dies are stacked using TSVs on top of a per-stack buffer die [1] and those buffer dies are hanging off of the data bus and t
by formerly_proven 3y ago
These would be 3DS-RDIMMs: The DRAM dies are stacked using TSVs on top of a per-stack buffer die [1] and those buffer dies are hanging off of the data bus and the module's C/A bus register. So my guess is these will be rather expensive per GB and mostly be bought for in-memory databases, specifically SAP HANA.
[1] https://en.wikichip.org/wiki/3ds_dimm https://en.wikichip.org/wiki/3ds_dimm
- mschuster91 3y agoTrust SAP to always be the first software making use of ungodly amounts of memory...
- yowlingcat 3y agoI'm no huge fan of SAP, but SAP HANA is an in memory database. What does its memory utilization have to do with the vendor rather than the use case?
- mschuster91 3y agoMost SAP stuff is just horribly inefficient, especially the stuff that people "customize"... it's like with the cloud in general, a well designed bespoke software beats the "golden standard" by far in resource usage.