3 ms·
The current limitations are not about litho at all but actually about CoWoS stacking capacity.
by paulmd 3y ago
The current limitations are not about litho at all but actually about CoWoS stacking capacity.
- deleted 3y ago[deleted]
- riow 3y ago``` CoWoS stands for Chip on Wafer on Substrate. It is a high-density packaging technology for high-performance chips. TSMC developed CoWoS in 2012. In CoWoS, multiple silicon dies are placed on a silicon interposer, which is an intermediate layer on the package board. The interposer acts as a communication layer for the active die on top. CoWoS is a 2.5D packaging technology. It is widely used in high performance computing. ```