3 ms·

Can someone please explain the physics behind 1) A "faulty connection" and why it fails at a certain temp? Is it a partially broken circuit that doesn't work a

• kortex 3y ago
  It sounds like to me a faulty solder joint (crack between the smd pin and the pad). Cooling probably causes a differential contraction which brings the pin into better contact, and of course clamping achieves the same. It may have started with a hairline defect that got worsened by thermal cycles. If it is a bad solder joint, reflowing bridges and fixes the joint. It won't harm the chips as long as the temperature is correct, since it needed to be soldered in a reflow oven in the first place. However (I believe) there is some risk of excess heat corrupting some data, and/or worsening the defect, so if you can back up first using the jury-rig, that's certainly preferable.
• numpad0 3y ago
  Coefficient of thermal expansion is related to density of an object, so chips with higher density and circuit boards with lower density expands to different sizes at the same temperature. Something will have to give way eventually, and usually the solder balls that join chips to the board do so by building up cracks. It WILL do other harms to the SSD. Semiconductor parts have limited reflow counts allowed to meet specifications such as failure rates, longevity, maybe power consumption too. It will be a factor at scale or over time. But it's free extra half life for semi broken parts too.