3 ms·
Yes, but in turn the failure is because the thermal expansion coefficient of the board and component were insufficiently closely matched (when taking into accou
by londons_explore 3y ago
Yes, but in turn the failure is because the thermal expansion coefficient of the board and component were insufficiently closely matched (when taking into account the elasticity of the board and component)
- giantrobot 3y agoLead-free solder is just shittier than leaded solder. You're not wrong about design but better solder would reduce the impact of mismatched thermal expansion properties.
- jandrese 3y agoBGAs and hot chips are a bad combo.