5 ms·
I think the main benefit of joining two dies together via some advanced interconnect is the latency. Memory lookups are much quicker on Apple Silicon which, in
by huijzer 3y ago
I think the main benefit of joining two dies together via some advanced interconnect is the latency. Memory lookups are much quicker on Apple Silicon which, in turn, avoids many wasted clock ticks waiting for data.
- brucethemoose2 3y agoAre you talking about the M1 Extreme? This is extremely expensive, and I suspect the dual die GPU only works because of Metal. TBH I prefer AMD's 7900 series approach of pushing the memory controller + cache out onto little memory controller dies. This allows for a monolithic GPU with a really wide bus, without all that wasted space on the controller/cache/pins. And those dies don't care about being split up since the memory access is interleaved anyway.
- 58028641 3y agoIsn’t it Pro, Max, Ultra?
- brucethemoose2 3y agothonk I can't remember, you are probably right. There is the little, medium, and big die, and the 2x big die.
- sliken 3y agoThe biggest single die is the m2 max. Dual die chip is the ultra.
- olliej 3y ago"M1 Extreme? This is extremely expensive" hence the name :D That said I think it's pro and ultra, and I can't recall which (if not both) use the magic interconnect