4 ms·
Back in the 00s, the transition to lead free solder was blamed for the high failure rate of BGA packages found in consoles and GPUs. One of the theories at the
by scrlk 3y ago
Back in the 00s, the transition to lead free solder was blamed for the high failure rate of BGA packages found in consoles and GPUs.
One of the theories at the time was that the poor thermal design of these devices (the most notable example being the Xbox 360) lead to cracks in the solder balls after repeated thermal cycling.
- robocat 3y ago> poor thermal design Also tin whiskers are a definite problem. https://www.google.com/search?q=lead-free+whiskers&tbm=isch https://www.google.com/search?q=lead-free+whiskers&tbm=isch https://www.analog.com/en/technical-articles/tin-whiskers-are-real-and-complex.html https://www.analog.com/en/technical-articles/tin-whiskers-ar...