2 ms·
Could you explain this a bit more? Do you mean wire bonding to package and/or silicon to interposer? Considering the number of bonds required and the extremely
by picture 3y ago
Could you explain this a bit more? Do you mean wire bonding to package and/or silicon to interposer? Considering the number of bonds required and the extremely low cost of modern ICs, there's no way to manually bond them besides maybe precision stuff like the hand-trimmed Vishay resistors. The higher end modern chips are also BGA from silicon to interposer, or even directly WLCSP, so there's nothing for humans to do anyway.
- gumby 3y agoSorry, I spoke very poorly. I meant that between completing a wafer and chips arriving at foxconn many humans are involved. I didn't mean to imply that women were manually bonding wires like in the 1960s but it looked like that was what I was saying.