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I suppose that the packaging problem can be solved - up to a point - with stacking vertically as well as placing them next to the io die. Wonder how well that w
by OliverGuy 3y ago
I suppose that the packaging problem can be solved - up to a point - with stacking vertically as well as placing them next to the io die. Wonder how well that will scale, could we stack multiple chiplets high? What effect would that have on thermals?
- jackmott 3y ago[dead]
- _hypx 3y agoVertical chip stacking is another idea being proposed. But as you said, that will have thermal problems. It could be possible to stack less power-hungry chips like cache chips, but probably not the main CPU/GPU core. It will just be another way of extending Moore’s Law.
- bravetraveler 3y agoWould the X3D cache setup for the newer AMD CPUs count as vertical chips? I'm a bit naive of the actual... physical bits. I'm not clear what makes a chip, and if the cache would be that - or something a bit simpler
- jagger27 3y agoYes, it totally counts and is indeed being vertically stacked on Ryzen products today. Cache takes up a huge portion of total die area and doesn’t hurt temperatures too much. For now, AMD is using the technique to add more cache to their CPUs rather than moving all of it to another layer.
- adgjlsfhk1 3y agoAs I understand it, this is because the 3d stacking is fairly expensive (it adds a lot of silicon and extra manufacturing cost), so 3d cache only makes sense once your chip is too big to put all the cache in 2D.
- convolvatron 3y agoI suspect there is a yield issue also. that is one large chip with one defect in the wrong place is just glass. with chipsets you would assemble the module after chipset unit test. but maybe redundancy and binning has made this moot.
- voldacar 3y agoWhat if you added tiny hollow channels between each layer of stacked chiplets and pumped coolant through them at high pressure