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TSMC Shares More Info on 2nm: New MIM Capacitor and Backside PDN Detailed
- ksec 3y ago>Backside PDN is a part of TSMC's N2P fabrication technology that will enter HVM in late 2026 or early 2027. This is slightly later than expected. And will actually be a full node behind N2. If we were to expect N2 to ship in 2H 2025. Entering HVM in early 2027 we are talking about product shipment in 2H 2027 already depending on launch volume. Will be interesting to see how well Intel execute on their IFS. Right now things seems to be doing great, but that is mostly because they are still in the catch up stage.
- meepmorp 3y agoIs IFS going well? I saw this today: https://www.bizjournals.com/sanjose/news/2023/05/30/intel-foundry-services-chips.html https://www.bizjournals.com/sanjose/news/2023/05/30/intel-fo... iirc, they got MediaTek as a wafer customer last year sometime, but of the two big customers they announced early on - Qualcomm and AWS - the former has apparently backed away, and I haven't heard anything about the latter. I'm pulling for them, if for no other reason than having some more industry diversity and physical distance from China. But I haven't heard tons of good news.
- ksec 3y agoIn terms of Business, it may not be great but it is not bad either. Switching Fabs is hard. And getting your direct competitor to join is even harder. But they are working on it. But in terms of technology, rather than their previous IFS which was complete BS and doesn't work. Intel is actually working closer towards TSMC's model in terms of transparency and opening up to others. From that perspective they are going great.