3 ms·
The article says: > The chip is being manufactured by Globalfoundries on the 12-nanometer low-power process. As far as I can tell it is not radiation hardened
by sanxiyn 3y ago
The article says:
> The chip is being manufactured by Globalfoundries on the 12-nanometer low-power process.
As far as I can tell it is not radiation hardened yet. I think what the article is trying to say is that since it is an open source hardware, ESA is not dependent on the vendor for radiation hardening.
- formerly_proven 3y agoGlofo 12nm is an FD-SOI process, which is inherently less sensitive to radiation than normal bulk CMOS. Since the substrate is an isolator SOI devices are also generally immune to latchup.