In one way, you are correct. TSMC's decision to use "Black Diamond" CVD was driven by previous failures of "spin-on" dielectric that allowed them to deliver co

In one way, you are correct. TSMC's decision to use "Black Diamond" CVD was driven by previous failures of "spin-on" dielectric that allowed them to deliver copper interconnects before anyone else. However, the R&D cycle, which failed for "spin-on," otherwise allowed TSMC to deliver faster, as they ran in multiple shifts, allowing accelerated focus on the new node.