The interview that I posted above discusses copper interconnects that IBM research introduced. TSMC had previously used a "spin-on" dialectic technique at a pr

The interview that I posted above discusses copper interconnects that IBM research introduced. TSMC had previously used a "spin-on" dialectic technique at a previous node, and reverted to CVD because of problems. They were able to beat all other manufacturers to market with copper interconnects (including IBM), because they avoided spin-on, which worked well in testing, but not in production. They had great luck in gaining this prior experience.