4 ms·
Hmm, if this is right then some of the illustrations might not be showing quite what is intended. We assumed that the rectangular gray structure in the upper l
by nkurz 4y ago
Hmm, if this is right then some of the illustrations might not be showing quite what is intended. We assumed that the rectangular gray structure in the upper left of each square chip was the laser. All the other illustrations (lower in the article and in color) show different ways these can be attached, one per chip. If the bright yellow blobs on the smallest squares are also lasers, something is off.
In some ways it's fascinating that illustrations for technical articles work at all. Usually there are two layers of people who may not understand the tech between the artist and the scientists, and no direct communication allowed. Choices often come down to Googling to find earlier publications online by the same group, and hoping those earlier illustrations were accurate.
- tarlinian 4y agoThe tiny yellow blobs are the bonded lasers, so the locations of the bonded lasers in the subsequent figures are incorrect but still get the point across. This page from IMEC has a video actually showing some of the process. (The image at the top is from a press release from them about successfully doing flip chop bonding of lasers.) https://www.imec-int.com/en/silicon-photonic-ICs-prototyping https://www.imec-int.com/en/silicon-photonic-ICs-prototyping
- nimish 4y agoI think it still gets the point across, namely that you have to stick one chip on top of another, but it's a little wild they didn't at least give the artist labeled notes and legends