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CMOS and DRAM are completely different processes and cannot be integrated on the same wafer. This has been tried many times unsuccessfully. This is why you see
by mateja 3y ago
CMOS and DRAM are completely different processes and cannot be integrated on the same wafer. This has been tried many times unsuccessfully. This is why you see highly integrated packaging solutions like chiplets. These solutions integrate CMOS and DRAM in the same package, not on the same die.
- ilyt 3y agoChiplets are also used for that, sure (stuff like radios are occasionally separate chiplet made in different process), but I think main push is smaller chips = higher yields
- yazaddaruvala 3y agoThanks, this is what I'd love to understand better. At the highest level isn't it all EUV? Why can't the laser print both patterns onto the wafer?
- realjhol 3y agoA CMOS chip doesn't contain any capacitors. DRAM is made of capacitors, and thus has a radically different structure.