> Interposers. Interposers are just one way of packaging MCM designs. AMD's RX 7900 series doesn't use a silicon interposer, it's still an (early) MCM design

> Interposers. Interposers are just one way of packaging MCM designs. AMD's RX 7900 series doesn't use a silicon interposer, it's still an (early) MCM design (although of course it's only pulling out memory controllers and cache, not multi-GCD). And technically since it's already a fiberglass package, there's no reason you can't stick things right onto a PCB instead, it's just a matter of convenience for partners placing/routing one thing instead of 7 things. https://www.techpowerup.com/301071/amd-explains-the-economics-behind-chiplets-for-gpus https://www.techpowerup.com/301071/amd-explains-the-economic... Infinity Fanout integration is a different type of MCM integration with some of its own upsides (cost) and downsides (higher power, less bumpout). There's also bridges, and actual 3D stacks of multiple compute dies (or 2.5D with memory/etc) that don't use interposers at all. https://semiengineering.com/using-silicon-bridges-in-packages/ https://semiengineering.com/using-silicon-bridges-in-package... All of these are technically MCM - MCM is any sort of multi-chip package. MCM also really does include things like Core2Quad, Pentium-D, Crystalwell, Xenos, and various IBM modules in the 70s and 80s. The idea has been kicking around for a long time and "multi-chip module" refers to all of them collectively, not just interposer-based CPUs. https://en.wikipedia.org/wiki/Multi-chip_module https://en.wikipedia.org/wiki/Multi-chip_module And while yes, stacking and direct-bonding are great and lower power requirements a lot... there are still dies with stacking and no interposer! Ryzen x3d chips are a great example, v-cache is a MCM but there's no interposer there. And technically Ryzen itself (without v-cache) is also MCM too and still sees large benefits there too.